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MEMS

technology Maturity 9-11 Next article →

Micro-electromechanical systems, or MEMS, are microscopic devices that combine electronic and moving parts. These systems function by integrating a central processing unit, such as an integrated circuit chip, with several components that interact with the surroundings. These interacting components are often microsensors. While a single MEMS device might range from 20 micrometres to 1 millimetre in size, they can be arranged in large arrays. For example, digital micromirror devices can cover areas larger than 1000 mm2.

DLP CINEMA. A Texas Instruments Technology - Photo Philippe Binant
DLP CINEMA. A Texas Instruments Technology - Photo Philippe Binant

Designing MEMS requires a different approach than designing large-scale mechanical machines. Because MEMS components are so small, they have a very large surface area relative to their volume. This means that forces like surface tension, viscosity, and ambient electromagnetism become critical design factors. Forces such as electrostatic charges and magnetic moments have a much greater impact at this scale. MEMS technology is distinct from molecular nanotechnology because it does not necessarily focus on surface chemistry.

MEMS Microcantilever in Resonance
MEMS Microcantilever in Resonance

Engineers build these devices using modified semiconductor fabrication technologies. The process begins with deposition, which adds thin films of material ranging from 1 to 100 micrometres thick. Physical vapor deposition (PVD) includes techniques like sputtering, where an ion beam liberates atoms from a target. Another method is evaporation, which uses heat or an electron beam in a vacuum. Chemical deposition, or CVD, involves a gas reacting on a substrate to grow material. After deposition, patterning transfers a specific design into the material.

Patterning often relies on lithography, which uses radiation to change a photosensitive material. In photolithography, light is used to create a mask on a substrate. For even smaller structures, scientists use electron beam lithography. This method scans a beam of electrons across a surface to create features in the nanometer range. While electron beam lithography can beat the diffraction limit of light, it is much slower than other methods. This slow speed can make the process vulnerable to beam drift or instability.

MEMsfounding
MEMsfounding

Many different materials are used to construct MEMS, with silicon being the most common. Silicon is used for most modern integrated circuits because it is inexpensive and high-quality. In its single crystal form, silicon is a Hookean material, meaning it shows almost no energy loss when flexed. This makes silicon incredibly reliable, allowing it to survive billions or even trillions of cycles without fatigue. Scientists also use silicon nanowires for advanced applications like nanowire batteries.

BioMEMS with X-shpaed cantilever
BioMEMS with X-shpaed cantilever

Other materials offer unique advantages for specific tasks. Polymers are excellent for microfluidic applications, such as disposable blood testing cartridges, because they can be produced in huge volumes. Metals like gold, aluminum, and titanium are also used through processes like electroplating or sputtering. Ceramics, such as silicon carbide or aluminum nitride, are used for their specialized properties. For instance, aluminum nitride shows piezoelectric properties, which allows it to act as a sensor for force. Titanium nitride is used because it is highly conductive and resists biocorrosion in biological environments.

There are two primary types of MEMS switch technology: capacitive and ohmic. A capacitive switch uses a moving plate or sensing element to change the capacitance of the system. An ohmic switch is controlled by cantilevers that are managed electrostatically. However, ohmic switches face certain risks, such as contact wear or metal fatigue. This happens because the cantilevers can deform over time.

BioMEMS with X-shpaed cantilever
BioMEMS with X-shpaed cantilever

The history of MEMS shows a long interest in miniature machines. In 1959, Richard Feynman gave a famous lecture titled "There's Plenty of Room at the Bottom." Early mechanical examples include the resonant-gate transistor, developed by Robert A. Wickstrom in 1965. Later, Raymond J. Wilfinger patented the resonistor between 1966 and 1971. The actual term "MEMS" was introduced in 1986 by S.C. Jacobsen and J.E. Wood in a proposal to DARPA. As these systems continue to shrink toward the nanoscale, they are referred to as nanoelectromechanical systems, or NEMS.

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🖼️ Images & Media (5)
File:MEMS Microcantilever in Resonance.png
MEMS Microcantilever in Resonance.png
File:MEMsfounding.jpg
MEMsfounding.jpg
File:BioMEMS with X-shpaed cantilever.png
BioMEMS with X-shpaed cantilever.png
File:DLP CINEMA. A Texas Instruments Technology - Photo Philippe Binant.jpg
DLP CINEMA. A Texas Instruments...
Gold stripe testing with MEMS.webm
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